IBM, Mitsubishi to jointly develop radio frequency chips for 3G handsets

EAST FISHKILL, NY (AFX) - International Business Machines Corp said it and Mitsubishi Electric Corp will jointly develop radio frequency integrated circuit chipsets for 3G wireless handsets under a multi-year technology agreement.

	    Specific financial terms were not disclosed.

	    The chipsets will be manufactured at IBM's Vermont facility and the chipsets are targeted for volume shipment to Mitsubishi in the fourth quarter.

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